A small continuous-loop magnetic tape cartridge that was used earlier for data storage. See Stringy Floppy
The base unit of chip making. A wafer is a slice taken from a salami-like silicon crystal ingot up to 300 mm (11.8") in diameter. The larger the wafer, the more chips produced in a single production pass, which comprises a series of photomasking, etching and implantation steps. Wafers are approximately 1/30th of an inch thick; however, the actual layers of transistors that make up the active circuitry are only a few microns deep.
Wafers started out from one to three inches in diameter. Then came 100 mm ingots (3.9"), followed by 125, 150, 200 and 300 mm. The much larger 450 mm wafer has yet to catch on due to the huge investment in new machinery. See chip
and wafer scale integration
The Boule Is Sliced
The silicon ingot, which is known as a "boule," is sliced into wafers. (Image courtesy of IBM.)
From top to bottom, the wafers are 150, 200 and 300 mm. (Images from top to bottom courtesy of Texas Instruments, Inc., Advanced Micro Devices, Inc. and Intel Corporation.).
Heating the Wafers
The red glow comes from a furnace that reaches 1000 degrees centigrade. The semiconductor wafers are baked in the oven to prepare them for the chip-making process. (Image courtesy of Intel Corporation.)