AI Term of the Moment
GSAi
Redirected from: multichip module
Definition: MCM
(MultiChip Module or MicroChip Module) A chip package containing two or more bare chips known as "chiplets" that are mounted close together on a substrate (base). The short tracks between the chiplets eliminate much of the noise that the lines between separate chip packages pick up. Multichip modules also allow different transistor technologies to be used in the same package.
Chiplets Make One Large Chip
An MCM is an option for fabricating a system-on-chip (SoC), which has several processing circuits. By combining several chiplets on the same substrate, a comprehensive system can be manufactured at less cost because when everything is built on one large chip, wafer failure rates are higher. See SoC.
More Flexible for the Future
In addition, there may be no need for all circuits to be at the same technology level. For example, the AI processor can be state-of-the-art, while the CPU and memory may be previous generations. In addition, critical components can be continuously enhanced without redesigning the entire chip, and they can also be farmed out to foundries with more advanced equipment. Elon Musk's Terafab is expected to use chiplets (see Terafab). See chiplet printer, MCM classes and MCP.
Integrated and Separated
Chiplets Make One Large Chip
An MCM is an option for fabricating a system-on-chip (SoC), which has several processing circuits. By combining several chiplets on the same substrate, a comprehensive system can be manufactured at less cost because when everything is built on one large chip, wafer failure rates are higher. See SoC.
More Flexible for the Future
In addition, there may be no need for all circuits to be at the same technology level. For example, the AI processor can be state-of-the-art, while the CPU and memory may be previous generations. In addition, critical components can be continuously enhanced without redesigning the entire chip, and they can also be farmed out to foundries with more advanced equipment. Elon Musk's Terafab is expected to use chiplets (see Terafab). See chiplet printer, MCM classes and MCP.
The traditional approach to making chips is to put as many circuits as possible onto a single chip (top). However, chiplets (bottom) offer huge flexibility. They allow circuits to come from different sources as well as divide the manufacturing both inhouse and externally. (Image courtesy of Arteris.)