Term of the Moment
BIOS
Redirected from: multichip module
Definition: MCM
(MultiChip Module or MicroChip Module) A chip package containing several bare die known as "chiplets" that are mounted close together on a substrate (base). The short tracks between the chiplets eliminate much of the noise that external lines between separate chip packages can pick up. Multichip packaging also allows different chip technologies to be used in the same package; for example, CMOS and bipolar.
Chiplets Make One Large Chip
An MCM is an option for fabricating a system-on-chip (SoC), which has several specialized processing circuits. By combining several small chiplets on the same substrate, a comprehensive system can be manufactured at less cost because when everything is built on one large chip, the failure rate of the die on the wafer is higher. See SoC and die.
More Flexible for the Future
In addition, there may be no need for all circuits on a chip to be at the same technology level. For example, the CPU and AI processor may be state-of-the-art, while memory and other components may require upgrading less often. The critical components can be continuously enhanced without redesigning the entire chip and they can be farmed out to foundries with more advanced equipment. Elon Musk's Terafab is expected to use this method (see Terafab). See chiplet printer, MCM classes and MCP.
Integrated and Separated
Chiplets Make One Large Chip
An MCM is an option for fabricating a system-on-chip (SoC), which has several specialized processing circuits. By combining several small chiplets on the same substrate, a comprehensive system can be manufactured at less cost because when everything is built on one large chip, the failure rate of the die on the wafer is higher. See SoC and die.
More Flexible for the Future
In addition, there may be no need for all circuits on a chip to be at the same technology level. For example, the CPU and AI processor may be state-of-the-art, while memory and other components may require upgrading less often. The critical components can be continuously enhanced without redesigning the entire chip and they can be farmed out to foundries with more advanced equipment. Elon Musk's Terafab is expected to use this method (see Terafab). See chiplet printer, MCM classes and MCP.
The traditional approach to making chips is to put as many circuits as possible onto a single chip (top). However, chiplets (bottom) offer huge flexibility; for example, enabling circuits to come from different sources as well as dividing the manufacturing both inhouse and externally. (Image courtesy of Arteris.)