Term of the Moment
cross assembler
Definition: MCP
(1) See Microsoft certification.
(2) (Master Control Program) See operating system.
(3) (MultiChip Package) A chip package that contains two or more chips. It is essentially a multichip module (MCM) that uses a laminated, printed-circuit-board-like substrate (MCM-L) rather than ceramic (MCM-C). MCPs are also tested after packaging, whereas the bare chips of ceramic-based MCMs were tested before packaging so as not to waste the more costly ceramic substrate if the chips were no good. See MCM.
Multichip Packages
(2) (Master Control Program) See operating system.
(3) (MultiChip Package) A chip package that contains two or more chips. It is essentially a multichip module (MCM) that uses a laminated, printed-circuit-board-like substrate (MCM-L) rather than ceramic (MCM-C). MCPs are also tested after packaging, whereas the bare chips of ceramic-based MCMs were tested before packaging so as not to waste the more costly ceramic substrate if the chips were no good. See MCM.
These are examples of multichip packages with stacked chips (top) and side-by-side chips (bottom). The chips are wire bonded to the resin-based substrate which is attached to the printed circuit board using a ball grid array (BGA). (Illustration courtesy of Joseph Fjelstad.)