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Redirected from: vertical interconnect access

Definition: via


(1) By means of, by way of. From Latin for "way" or "path."

(2) (Virtual Interface Architecture) See VI.

(3) (Vertical Interconnect Access) In a printed circuit board, a conducting pathway between layers. The via is created by drilling a hole through the board where the layers interconnect. Copper fills the hole entirely or coats only the sides of the hole. See printed circuit board.

(4) (Vertical Interconnect Access) In a 3D chip, a conducting pathway between layers. Two or more stacked die are connected by "through-silicon vias" (TSVs), which are pathways that pass completely through the die.




TSV Pathways Between 3D Chips
The vertical blue lines are the insulated through-silicon vias (TSVs) between two chips on the same package. See system in package.






Creating Vias on Programmable Chips
In the antifuse programmable chip technology, a circuit is closed by turning non-conductive silicon into a conductive via. See antifuse.