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Redirected from: dual in-line package

Definition: DIP

(1) See device independent pixel.

(2) (Document Image Processing) See document imaging.

(3) (Dual In-line Package) A common, mostly-rectangular chip housing with leads (pins) on both sides. Tiny wires of a DIP bond the chip to metal leads that wind their way down into spider-like feet. The DIP is either plugged into a socket or inserted into holes in the printed circuit board and soldered. See DIP switch, CDIP, CERDIP and chip package.

Introduced in the 1960s, the DIP package was widely used for decades and still exists to hold microcontrollers and other electronic circuits.

Lots of DIPs
Taking up more room than BGA and other chip packages that are used today, DIP chips were popular in the past. See chip package.