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Redirected from: ASML TWINSCAN

Definition: High-NA EUV


(HIGH-Numerical Aperture EUV) A chip lithography method that captures light from wider angles and converges it into a sharper point. High-NA EUV has a wider .55 numerical aperture compared to .33 for standard EUV, and it supports feature sizes down to roughly 8 nm, which is a true measurement. See EUV light.

Intel Was the First
Intel is the first to use the ASML TWINSCAN EXE:5200B lithography system which uses High-NA EUV. Installed in Intel's Oregon facility in late 2025, TWINSCAN is expected in its upcoming 14A chip process. See Intel 14A.

Remember...
the 8 nm is the true physical feature size, but 14A (14 angstroms) is less than 1 nm and is strictly branding. See chip feature size.