(1) (
Three
Dimensional
Integrated
Circuit) An IC package that contains chips vertically stacked on top of each other. Interconnections are made by through-silicon vias (TSVs). See
via and
chip package.
(2) (
Three
Dimensional
Integrated
Circuit) A chip with multiple transistor layers vertically stacked. This type of 3D architecture is expected after complementary FETs (CFETs) become widespread.
3D Is on the Horizon
3D TVs never became popular but 3D chips are likely to become the norm in the 2030s. See
FinFET,
GAAFET and
CFET.