Term of the Moment
Kali
Definition: 3D IC
(1) (Three Dimensional Integrated Circuit) An IC package that contains chips vertically stacked on top of each other. Interconnections are made by through-silicon vias (TSVs). See via and chip package.
(2) (Three Dimensional Integrated Circuit) A chip with multiple transistor layers vertically stacked. This type of 3D architecture is expected after complementary FETs (CFETs) become widespread.
3D Is on the Horizon
(2) (Three Dimensional Integrated Circuit) A chip with multiple transistor layers vertically stacked. This type of 3D architecture is expected after complementary FETs (CFETs) become widespread.
3D TVs never became popular but 3D chips are likely to become the norm in the 2030s. See FinFET, GAAFET and CFET.